Princeton Microwave Technology has successfully demonstrated the transfer of technology for the MMIC package. During this contract the package design was licensed from Hughes Aircraft Company for manufacture within the U.S. A major effort was directed towards characterization of the ceramic material for its dielectric constant and loss tangent properties. After selection of a ceramic tape, the high temperature co-fired ceramic package was manufactured in the U.S. by Microcircuit Packaging of America, Inc. Microwave measurements of the MMIC package were conducted by an intercontinental microwave test fixture. The package demonstrated a typical insertion loss of 0.5 dB per transition up to 32 Ghz and a return loss of better than 15 db. The performance of the package has been demonstrated from 2 to 30 Ghz by assembling three different MMIC amplifiers. Two of the MMIC amplifiers were designed for the 26 Ghz to 30 Ghz operation while the third MMIC was a distributed amplifier from 2 to 26.5 Ghz. The measured gain of the amplifier is consistent with the device data. The package costs are substantially lower than comparable packages available commercially. Typically the price difference is greater than a factor of three. The package cost is well under $5.00 for a quantity of 10,000 pieces.